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Fibeer SX Precision Processing

Precision LaserMicro‑Ablation System

Engineered for applications where every micron matters, our precision laser micro-ablation system enables highly controlled material removal with exceptional accuracy and repeatability. The contact-free process creates fine structures, functional textures and complex micro-geometries while preserving the integrity of the surrounding material.

By precisely adjusting pulse energy, frequency and scanning parameters, the system can be tailored to metals, plastics and sensitive technical components. This makes it an ideal solution for demanding industrial applications where consistent quality, minimal thermal impact and reliable production performance are essential.

Micron precisionContact-freeLow thermal impact
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Laser Ablation
Ultra Precision Surface Processing

Laser Ablation
& Etching

Laser ablation / laser etching is one of the most precise material-removal technologies, using ultra-short, high-energy pulses to remove the upper surface layer. The process enables micro-depth structures, micro-grooves, patterns or functional textures, all contact-free and without thermal distortion.

The laser interacts only with the targeted surface layer, leaving the underlying material intact. This makes it ideal for applications requiring extreme precision and repeatability: mold texturing, micro-machining of electronics, medical-device components, functional textures, or fine machining of metals and plastics.

µm
Micro Structures
0
Thermal Distortion
100%
Contact-Free
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Advanced Surface Processing

Why is laser ablation advantageous?

01
Micron-precision material removal
02
Contact-free, wear-free process
03
No tool wear, no post-processing
04
Repeatable patterns even in mass production
05
No thermal damage, minimal HAZ
06
Easily automated in robotic cells and production lines
µm Precision level
0 Mechanical contact
24/7 Automation ready
Laser ablation high precision material removal
Process Control
25.000 µm
Surface target Micro-structured zone
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